Patent Assignment
Reel/Frame 014459/0624
Assignment of Assignor's Interest
Recorded: 2003-09-02
Received: 2003-09-11
Pages: 4
Assignors
RUBINSZTAJN, SLAWOMIR
Executed: 2003-08-19
TONAPI, SANDEEP
Executed: 2003-08-20
PRABHAKUMAR, ANANTH
Executed: 2003-08-21
CAMPBELL, JOHN
Executed: 2003-08-25
Assignee
GENERAL ELECTRIC COMPANY
1 RIVER ROAD, SCHENECTADY, NY, 12345, UNITED STATES
Covered Property
(1)
No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
Application:
10/653,371 →