IP Library Assignment 014459/0624
Patent Assignment
Reel/Frame 014459/0624

Assignment of Assignor's Interest

Recorded: 2003-09-02 Received: 2003-09-11 Pages: 4
Assignors
RUBINSZTAJN, SLAWOMIR
Executed: 2003-08-19
TONAPI, SANDEEP
Executed: 2003-08-20
PRABHAKUMAR, ANANTH
Executed: 2003-08-21
CAMPBELL, JOHN
Executed: 2003-08-25
Assignee
GENERAL ELECTRIC COMPANY
1 RIVER ROAD, SCHENECTADY, NY, 12345, UNITED STATES
Covered Property (1)
No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
Application: 10/653,371 →