Patent Assignment
Reel/Frame 014507/0466
Assignment of Assignor's Interest
Recorded: 2003-09-17
Received: 2003-09-24
Pages: 2
Assignors
MAEJIMA, NOBUYOSHI
Executed: 2001-10-25
NEGISHI, MIKIO
Executed: 2001-10-25
YAMADA, TOMIO
Executed: 2001-10-25
YAMAURA, MASASHI
Executed: 2001-10-25
ENDOH, TSUNEO
Executed: 2001-10-31
KOIZUMI, TOMONICHI
Executed: 2001-10-31
NAKAJIMA, HIROKAZU
Executed: 2001-10-31
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
A Semiconductor Device Having an Elastic Resin with a Low Modulus of Elasticity
Application:
10/021,173 →