IP Library › Assignment 014511/0901
Patent Assignment
Reel/Frame 014511/0901

Assignment of Assignor's Interest

Recorded: 2003-09-25 Pages: 2
Assignors
MIYAMOTO, TOSHIO
Executed: 2001-12-14
ANJO, ICHIRO
Executed: 2001-12-14
NISHIMURA, ASAO
Executed: 2001-12-17
KATAGIRI, MITSUAKI
Executed: 2002-01-07
SHIRAI, YUJI
Executed: 2002-01-09
YAMAGUCHI, YOSHIHIDE
Executed: 2001-12-20
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, JAPAN
Covered Property (1)
Wafer Level Chip Size Package Having Rerouting Layers
Patent: 6,861,742 →
Application: 10/046,446 →
Publication: US 2002/0093082
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 15, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014569/0186 →
Merger and Change of Name Sep 9, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024953/0672 →