Assignment of Assignor's Interest

Recorded: 2004-04-22 Pages: 2

Assignors

OMAN, TODD P.

Executed: 2004-04-13

DEGENKOLB, THOMAS A.

Executed: 2004-04-14

Assignee

DELPHI TECHNOLOGIES, INC.

P. O. BOX 9005, ONE CORPORATE CENTER, CT10C, KOKOMO, INDIANA, 46904-9005

Covered Property (1)

Multi-Substrate Circuit Assembly

Patent: 7,064,963 →

Application: 10/708,935 →

Publication: US 2005/0218505

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.