IP Library › Assignment 014522/0818
Patent Assignment
Reel/Frame 014522/0818

Assignment of Assignor's Interest

Recorded: 2003-09-22 Pages: 2
Assignors
HATA, TOSHIYUKI
Executed: 2002-08-29
SHIMIZU, ICHIO
Executed: 2002-08-29
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
A Semiconductor Package Including a Plurality of Semiconductor Chips Therein
Patent: 6,882,047 →
Application: 10/268,697 →
Publication: US 2003/0075796
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 15, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014569/0186 →
Merger and Change of Name Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →