Patent Assignment
Reel/Frame 014525/0676
Merger
Recorded: 2003-09-24
Pages: 11
Assignor
LITE-ON ELECTRONICS, INC.
Executed: 2002-11-13
Assignee
LITE-ON TECHNOLOGY CORPORATION
5F, NO. 16, SEC. 4, NANKING E. RD., TAIPEI, R.O.C., TAIWAN
Covered Properties
(2)
Infrared Transceiver Package
Patent:
5,763,900 →
Application:
08/760,521 →
Display Module Including a Plate for Heat Dissipation and Shielding
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 4, 2008
From: LITE-ON TECHNOLOGY CORP.
To: GUAN TECHNOLOGIES, LLC
Reel/Frame 020317/0552 →
Assignment of Assignor's Interest
Jan 7, 2008
From: LITE-ON TECHNOLOGY CORP.
To: GUAN TECHNOLOGIES, LLC
Reel/Frame 020403/0630 →
Assignment of Assignor's Interest
Apr 23, 2013
From: LITE-ON TECHNOLOGY CORPORATION
To: UTADA TECHNOLOGIES, LLC
Reel/Frame 030260/0612 →
Assignment of Assignor's Interest
Feb 12, 2023
From: UTADA TECHNOLOGIES, LLC
To: INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 062667/0741 →
Security Interest
Mar 24, 2023
From: MIND FUSION, LLC
To: INTELLECTUAL VENTURES ASSETS 191 LLC; INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 063295/0001 →
Assignment of Assignor's Interest
Jul 13, 2023
From: INTELLECTUAL VENTURES ASSETS 186 LLC
To: MIND FUSION, LLC
Reel/Frame 064271/0001 →