Patent Assignment
Reel/Frame 014528/0083
Assignment of Assignor's Interest
Recorded: 2003-09-25
Pages: 2
Assignors
DANNO, TADATOSHI
Executed: 2001-06-07
ARAI, KATSUO
Executed: 2001-06-07
SHIMIZU, ICHIO
Executed: 2001-06-07
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Manufacturing Method Wherein Electrode Members Are Exposed from a Mounting Surface of a Resin Encapsulator
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.