Patent Assignment
Reel/Frame 014530/0840
Assignment of Assignor's Interest
Recorded: 2003-06-26
Received: 2003-09-30
Pages: 4
Assignors
ASANO, TOSHIHIKO
Executed: 2003-04-23
IIJIMA, TOMOO
Executed: 2003-04-23
KATO, YOSHIRO
Executed: 2003-04-23
KUROSAWA, INETARO
Executed: 2003-04-23
ODAIRA, HIROSHI
Executed: 2003-04-23
SAKUMA, KAZUO
Executed: 2003-04-23
OHSAWA, MASAYUKI
Executed: 2003-05-06
ENDO, KIMITAKA
Executed: 2003-05-07
Assignee
NORTH CORPORATION
32-1 MINAMI-OTSUKA 3-CHOME, TOSHIMA-KU, TOKYO 170-0005, JPX, JAPAN
Covered Property
(1)
Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board
Application:
10/450,844 →