Patent Assignment
Reel/Frame 014549/0871
Assignment of Assignor's Interest
Recorded: 2003-10-03
Pages: 3
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property
(1)
Flip-chip integrated circuit package
Application:
10/199,438 →
Publication:
US 2004/0012094
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 8, 2004
From: HEWLETT-PACKARD COMPANY
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 015232/0278 →
Clarification to Patent and Patent Application Assignment
Mar 31, 2005
From: HEWLETT-PACKARD COMPANY; AGILENT TECHNOLOGIES INC.; HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT-PACKARD COMPANY; HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; AGILENT TECHNOLOGIES, INC.
Reel/Frame 015980/0930 →