Patent Assignment
Reel/Frame 014576/0783
Assignment of Assignor's Interest
Recorded: 2003-06-23
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Etchant for Wires, a Method for Manufacturing the Wires Using the Etchant, a Thin Film Transistor Array Substrate and a Method for Manufacturing the Same Including the Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.