IP Library › Assignment 014594/0161
Patent Assignment
Reel/Frame 014594/0161

Assignment of Assignor's Interest

Recorded: 2003-10-15 Pages: 3
Assignors
NARUOKA, HIDEKI
Executed: 2003-09-09
HATTORI, NOBUYOSHI
Executed: 2003-09-09
YAMAMOTO, HIDEKAZU
Executed: 2003-09-09
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Method of Manufacturing Soi Wafer
Patent: 6,844,242 →
Application: 10/113,291 →
Publication: US 2003/0013273
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025917/0837 →