Patent Assignment
Reel/Frame 014619/0620
Assignment of Assignor's Interest
Recorded: 2003-10-17
Pages: 3
Assignee
ONDEO NALCO COMPANY
ONDEO NALCO CENTER, NAPERVILLE, ILLINOIS, 60563-1198
Covered Property
(1)
Method of inhibiting corrosion of copper plated or metallized surfaces and circuitry during semiconductor manufacturing processes
Application:
10/617,467 →
Publication:
US 2005/0008532
Related Assignments
(9)
Other recorded transfers of the patent in this record — the chain of ownership.
Grant of Security Interest
Dec 2, 2003
From: ONDEO NALCO COMPANY
To: NALCO COMPANY
Reel/Frame 014822/0305 →
Grant of Security Interest
Dec 8, 2003
From: NALCO COMPANY
To: CITICORP NORTH AMERICA, INC., AS ADMINISTRATIVE AGENT
Reel/Frame 014805/0132 →
Security Agreement
May 18, 2009
From: NALCO COMPANY; CALGON LLC; NALCO ONE SOURCE LLC; NALCO CROSSBOW WATER LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 022703/0001 →
Release of Security Interest
May 26, 2015
From: BANK OF AMERICA, N.A.
To: NALCO COMPANY
Reel/Frame 035771/0668 →
Release of Security Interest
Feb 24, 2017
From: BANK OF AMERICA, N.A.
To: NALCO COMPANY
Reel/Frame 041808/0713 →
Assignment of Assignor's Interest
Feb 28, 2017
From: NALCO COMPANY LLC; CALGON CORPORATION; CALGON LLC; ONDEO NALCO ENERGY SERVICES, L.P.
To: ECOLAB USA INC.
Reel/Frame 041836/0437 →
Change of Name
Feb 28, 2017
From: NALCO COMPANY
To: NALCO COMPANY LLC
Reel/Frame 041835/0903 →
Release of Security Interest
Feb 28, 2017
From: CITICORP NORTH AMERICA, INC.
To: NALCO COMPANY
Reel/Frame 041832/0826 →
Assignment of Assignor's Interest
Apr 4, 2017
From: NALCO COMPANY
To: ECOLAB USA INC.
Reel/Frame 042147/0420 →