Patent Assignment
Reel/Frame 014619/0801
Assignment of Assignor's Interest
Recorded: 2003-10-15
Pages: 3
Assignors
KIM, KYUNG-SOO
Executed: 2003-09-22
KIM, YOUNG-WUG
Executed: 2003-09-22
OH, CHANG-BONG
Executed: 2003-09-22
KANG, HEE-SUNG
Executed: 2003-09-22
RYU, HYUK-JU
Executed: 2003-09-22
Assignee
SAMSUNG ELECTRONICS, CO., LTD.
416, MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Multi-Thickness Gate Dielectric Layer of Semiconductor Device