Patent Assignment
Reel/Frame 014650/0426
Assignment of Assignor's Interest
Recorded: 2003-10-31
Pages: 2
Assignors
KURITA, YOICHIRO
Executed: 2003-07-22
NOGAWA, JUN
Executed: 2003-07-22
MAEDA, MASATO
Executed: 2003-07-22
INOMATA, TERUJI
Executed: 2003-07-22
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONAUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Bonding Method and Bonding Apparatus
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.