Patent Assignment
Reel/Frame 014702/0227
Assignment of Assignor's Interest
Recorded: 2003-11-13
Pages: 3
Assignor
DOI, SATOSHI
Executed: 2003-11-06
Assignee
NEC LCD TECHNOLOGIES, LTD.
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, JAPAN
Covered Property
(1)
Method for Forming Interconnections Including Multi-Layer Metal Film Stack for Improving Corrosion and Heat Resistances
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 7, 2010
From: NEC LCD TECHNOLOGIES, LTD.
To: NEC CORPORATION
Reel/Frame 024492/0176 →
Assignment of Assignor's Interest
May 10, 2011
From: NEC CORPORATION
To: GETNER FOUNDATION LLC
Reel/Frame 026254/0381 →
Assignment of Assignor's Interest
Feb 28, 2018
From: GETNER FOUNDATION LLC
To: VISTA PEAK VENTURES, LLC
Reel/Frame 045469/0164 →