IP Library Assignment 014768/0019
Patent Assignment
Reel/Frame 014768/0019

Assignment of Assignor's Interest

Recorded: 2003-12-04 Pages: 2
Assignor
NAKAGAWA, TATSUYA
Executed: 2000-10-13
Assignee
KABUSHIKI KAISHA TOSHIBA
72 HORIKAWA, SAIWAI-KU, KAWASAKI, KANAGAWA, JAPAN
Covered Property (1)
Component Mounting Circuit Board with Resin-Molded Section Covering Circuit Pattern and Inner Components
Patent: 7,203,071 →
Application: 10/726,660 →
Publication: US 2004/0090753
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement (Short-Form) Feb 2, 2022
From: EVERI HOLDINGS INC.
To: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 058948/0265 →
Termination and Release of Patent Security Agreement Recorded at Reel 058948, Frame 0265 Jul 1, 2025
From: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
To: EVERI HOLDINGS INC.
Reel/Frame 071791/0236 →