Patent Assignment
Reel/Frame 014774/0316
Assignment of Assignor's Interest
Recorded: 2003-12-08
Pages: 3
Assignor
SILVERBROOK, KIA
Executed: 2003-11-28
Assignee
SILVERBROOK RESEARCH PTY. LTD.
393 DARLING STREET, BALMAI, NSW 2041, AUSTRALIA
Covered Property
(1)
Chips with Wafer Scale Caps Formed by Molding
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 6, 2013
From: SILVERBROOK RESEARCH PTY LTD
To: PRECISION MECHATRONICS PTY LTD
Reel/Frame 030554/0453 →
Assignment of Assignor's Interest
Jul 2, 2013
From: PRECISION MECHATRONICS PTY LTD
To: KERWAR ACQUISITIONS LLC
Reel/Frame 030745/0086 →
Merger
Jan 13, 2016
From: KERWAR ACQUISITIONS LLC
To: NYTELL SOFTWARE LLC
Reel/Frame 037482/0523 →