Patent Assignment
Reel/Frame 014944/0171
Assignment of Assignor's Interest
Recorded: 2004-01-29
Received: 2004-02-05
Pages: 2
Assignor
KAZUHIDE, ABE
Executed: 2003-12-26
Assignee
OKI ELECTRONIC INDUSTRY CO., LTD.
7-12 TORANOMON 1-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Wiring structure of semiconductor device and method of manufacturing the same
Application:
10/766,739 →