Patent Assignment
Reel/Frame 014944/0689
Assignment of Assignor's Interest
Recorded: 2004-01-30
Pages: 2
Assignor
SAEKI, YOSHIHIRO
Executed: 2003-12-17
Assignee
OKI ELECTRONIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME,, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Chip and Semiconductor Device Including Lamination of Semiconductor Chips
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 7, 2004
From: SAEKI, YOSHIHIRO
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 015109/0472 →
Change of Name
Dec 24, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022052/0797 →
Change of Name
Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →