Assignment of Assignor's Interest

Recorded: 2004-01-30 Pages: 2

Assignor

TERUI, MAKOTO

Executed: 2003-12-24

Assignee

OKI ELECTRIC INDUSTRY CO., LTD.

7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Passive Element Chip and Manufacturing Method Thereof, and Highly Integrated Module and Manufacturing Method Thereof

Patent: 7,102,227 →

Application: 10/766,896 →

Publication: US 2005/0093142

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.