Patent Assignment
Reel/Frame 014957/0595
Assignment of Assignor's Interest
Recorded: 2004-02-02
Pages: 3
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA 571-8501, JAPAN
Covered Property
(1)
Soldering method and method for manufacturing component mounting board
Application:
10/770,292 →
Publication:
US 2004/0155097
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.