Patent Assignment
Reel/Frame 014983/0274
Assignment of Assignor's Interest
Recorded: 2004-02-10
Pages: 4
Assignors
VAN NGO, MINH
Executed: 2003-12-09
HUERTAS, ROBERT A.
Executed: 2003-12-09
PHAM, HIEU
Executed: 2004-01-14
Assignee
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE, P.O. BOX 3453, SUNNYVALE, CALIFORNIA, 94088-3453
Covered Property
(1)
Method of Treating Inlaid Copper for Improved Capping Layer Adhesion Without Damaging Porous Low-K Materials
Patent:
6,875,694 →
Application:
10/774,418 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 2, 2009
From: ADVANCED MICRO DEVICES, INC.
To: AMD TECHNOLOGIES HOLDINGS, INC.
Reel/Frame 022764/0488 →
Assignment of Assignor's Interest
Jun 2, 2009
From: AMD TECHNOLOGIES HOLDINGS, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 022764/0544 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →