Patent Assignment
Reel/Frame 014985/0168
Assignment of Assignor's Interest
Recorded: 2004-02-12
Pages: 2
Assignor
LEUNG, PAK
Executed: 2004-01-08
Assignee
UNITED MICROELECTRONICS CO.
NO. 3, LI-HSIN RD. 11, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, R.O.C. 30077, TAIWAN
Covered Property
(1)
Stress-Relief Layer for Semiconductor Applications
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 17, 2004
From: BARTH, HANS-JOACHIM; KALTALIOGLU, ERDEM; HOINKIS, MARK D.; FRIESE, GERALD R.
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 014979/0956 →
Assignment of Assignor's Interest
Aug 23, 2004
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 015019/0284 →