Patent Assignment
Reel/Frame 014988/0348
Assignment of Assignor's Interest
Recorded: 2003-09-16
Received: 2004-02-23
Pages: 3
Assignor
MACNEIL, JOHN
Executed: 2003-09-05
Assignee
TRIKON HOLDINGS LIMITED
COED RHEDYN, RINGLAND WAY, NEWPORT, GWENT, GBX, NP18 2TA, UNITED KINGDOM
Covered Property
(1)
Method of filling a via or recess in a semiconductor substrate
Application:
10/471,995 →