Patent Assignment
Reel/Frame 015038/0176
Assignment of Assignor's Interest
Recorded: 2004-03-01
Pages: 2
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method and Apparatus for Manufacturing Beads Array Chip