Patent Assignment
Reel/Frame 015053/0889
Assignment of Assignor's Interest
Recorded: 2003-10-23
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, PALDAL-KU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wire Structure a Thin Film Transistor Substrate of Using the Wire Structure and a Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.