Patent Assignment
Reel/Frame 015073/0151
Assignment of Assignor's Interest
Recorded: 2004-08-18
Pages: 3
Assignor
YUDASAKA, ICHIO
Executed: 2004-07-20
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME,, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Coating Apparatus, Thin Film Forming Method, Thin Film Forming Apparatus, and Semiconductor Device Manufacturing Method, Electro-Optic Device and Electronic Instrument