Assignment of Assignor's Interest

Recorded: 2004-03-12 Pages: 3

Assignor

LEE, JONG-JOO

Executed: 2004-02-27

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Area array type package stack and manufacturing method thereof

Application: 10/798,943 →

Publication: US 2005/0040508

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.