Patent Assignment
Reel/Frame 015120/0460
Assignment of Assignor's Interest
Recorded: 2004-03-19
Pages: 2
Assignors
KOIDE, MASATERU
Executed: 2004-03-09
UMEMATSU, MISAO
Executed: 2004-03-09
KANDA, TAKASHI
Executed: 2004-03-09
USUI, YASUHIRO
Executed: 2004-03-09
FUKUZONO, KENJI
Executed: 2004-03-09
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Covered Property
(1)
Packaging Method, Packaging Structure and Package Substrate for Electronic Parts