Patent Assignment
Reel/Frame 015207/0751
Assignment of Assignor's Interest
Recorded: 2004-04-13
Pages: 2
Assignor
NAKAMURA, AKIO
Executed: 2004-03-23
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor device including plural chips with protruding edges laminated on a die pad section
Application:
10/822,749 →
Publication:
US 2005/0104170