Patent Assignment
Reel/Frame 015216/0212
Assignment of Assignor's Interest
Recorded: 2004-10-04
Pages: 2
Assignor
TEYSSEYRE, JEROME
Executed: 2004-08-23
Assignee
STMICROELECTRONICS SA
29 BOULEVARD ROMAIN ROLLAND, 92120 MONTROUGE, FRANCE
Covered Property
(1)
Process for Encapsulating Semiconductor Components Using Through-Holes in the Semiconductor Components Support Substrates
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.