Patent Assignment
Reel/Frame 015228/0390
Assignment of Assignor's Interest
Recorded: 2004-04-16
Pages: 4
Assignor
HITACHI, LTD.
Executed: 2004-03-31
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Package Including Forming a Resin Member
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.