Patent Assignment
Reel/Frame 015360/0389
Assignment of Assignor's Interest
Recorded: 2004-01-20
Received: 2004-05-26
Pages: 3
Assignee
OSRAM OPTO SEMICONDUCTORS GMBH
WERNERWERKSTRASSE 2, REGENSBURG, DEX, 93049, GERMANY
Covered Property
(1)
Method for Subdividing Wafers into Chips
Application:
10/466,569 →