Patent Assignment
Reel/Frame 015385/0308
Assignment of Assignor's Interest
Recorded: 2004-05-28
Received: 2004-06-03
Pages: 3
Assignee
DAN J. WEBER, ASSISTANT SECRETARY
101 SOUTH HANLEY ROAD, VIASYSTEMS GROUP, INC., ST. LOUIS, MO, 63105, UNITED STATES
Covered Properties
(2)
Method of Fabricating Metal Interconnection of Semiconductor Device
Application:
10/747,664 →
Indoor-outdoor equipment enclosure and method for assemblying the same
Application:
60/382,839 →