Patent Assignment
Reel/Frame 015416/0727
Assignment of Assignor's Interest
Recorded: 2004-05-28
Pages: 2
Assignors
KAWANO, MASAYA
Executed: 2004-04-15
YAMAMOTO, YOSHIAKI
Executed: 2004-04-15
ITO, TAKAMASA
Executed: 2004-04-15
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property
(1)
Semiconductor device with interconnection structure for reducing stress migration
Application:
10/855,562 →
Publication:
US 2004/0238964
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.