Patent Assignment
Reel/Frame 015475/0592
Assignment of Assignor's Interest
Recorded: 2004-06-15
Pages: 3
Assignors
CHO, WON-HO
Executed: 2004-06-07
JO, GYOO-CHUL
Executed: 2004-06-10
LEE, GUE-TAI
Executed: 2004-06-07
KANG, JIN-GYU
Executed: 2004-06-07
JEONG, BEUNG-HWA
Executed: 2004-06-07
KIM, JIN YOUNG
Executed: 2004-06-07
Assignee
LG. PHILIPS LCD CO., LTD.
20, YOIDO-DONG, YOUNGDUNGPO-KU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Etchant for etching double-layered copper structure and method of forming array substrate having double-layered copper structures
Application:
10/867,007 →
Publication:
US 2004/0262569
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.