Patent Assignment
Reel/Frame 015494/0920
Assignment of Assignor's Interest
Recorded: 2004-06-25
Received: 2004-06-30
Pages: 12
Assignor
DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.)
Executed: 2004-06-09
Assignee
STAKTEK GROUP L.P.
8900 SHOAL CREEK BLVD., SUITE 125, AUSTIN, TX, 78757, UNITED STATES
Covered Property
(1)
Three-Dimensional Memory Stacking Using Anisotropic Epoxy Interconnections
Application:
09/826,621 →