Patent Assignment
Reel/Frame 015503/0296
Assignment of Assignor's Interest
Recorded: 2004-06-25
Received: 2004-06-30
Pages: 22
Assignor
DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.)
Executed: 2004-06-09
Assignee
STAKTEK GROUP L.P.
8900 SHOAL CREEK BLVD., SUITE 125, AUSTIN, TX, 78757, UNITED STATES
Covered Property
(1)
Stackable Flex Circuit Ic Package and Method of Making Same
Application:
09/888,792 →