Patent Assignment
Reel/Frame 015560/0667
Assignment of Assignor's Interest
Recorded: 2004-07-14
Received: 2004-07-19
Pages: 22
Assignor
DPAC TECNOLOGIES CORP.
Executed: 2004-06-09
Assignee
STAKTEK GROUP, LP
8900 SHOAL CREEK BLVD., SUITE 125, AUSTIN, TX, 78757, UNITED STATES
Covered Property
(1)
Panel stacking of BGA devices to form three-dimensional modules
Application:
10/290,994 →