Patent Assignment
Reel/Frame 015578/0596
Assignment of Assignor's Interest
Recorded: 2004-07-15
Pages: 3
Assignors
LEE, KANG-WOOK
Executed: 2004-06-23
KIM, GU-SUNG
Executed: 2004-06-23
JANG, DONG-HYEON
Executed: 2004-06-23
BAEK, SEUNG-DUK
Executed: 2004-06-29
CHUNG, JAE-SIK
Executed: 2004-06-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONTGTONG-GU, SUWON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Stack Package and Manufacturing Method Thereof