Patent Assignment
Reel/Frame 015608/0798
Assignment of Assignor's Interest
Recorded: 2004-07-21
Pages: 2
Assignor
TSAI, CHI-LONG
Executed: 2004-05-04
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
NO. 26, CHIN 3RD RD., NANTZE EXPORT, PROCESSING ZONE, KAOHSIUNG, R.O.C., TAIWAN
Covered Property
(1)
Method for Forming Bump Protective Collars on a Bumped Wafer