IP Library › Assignment 015618/0475
Patent Assignment
Reel/Frame 015618/0475

Assignment of Assignor's Interest

Recorded: 2005-01-24 Pages: 2
Assignor
Assignee
KONINKLIJKE PHILIPS ELECTRONICS N.V.
GROENEWOUDSEWEG 1, EINDHOVEN, 5621 BA, NETHERLANDS
Covered Property (1)
Method of Improving Adhesion of Cap Oxide to Nanoporous Silica for Integrated Circuit Fabrication
Patent: 6,876,063 →
Application: 09/902,056 →
Related Assignments (7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 2, 2005
From: PHILIPS SEMICONDUCTORS, INC.
To: KONINKLIJKE PHILIPS ELECTRONICS, N.V.
Reel/Frame 015814/0972 →
Assignment of Assignor's Interest Dec 15, 2006
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 018635/0787 →
Security Agreement Jan 22, 2007
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 018806/0201 →
Assignment of Assignor's Interest Oct 26, 2011
From: ANNAPRAGADA, RAO VENKATESWARA
To: VLSI TECHNOLOGY, INC.
Reel/Frame 027128/0322 →
Change of Name Sep 22, 2017
From: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
To: NXP B.V.
Reel/Frame 043951/0611 →
Assignment of Assignor's Interest Sep 22, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
Reel/Frame 043951/0127 →
Release of Security Interest Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC
To: NXP B.V.
Reel/Frame 050315/0443 →