IP Library › Assignment 015662/0281
Patent Assignment
Reel/Frame 015662/0281

Assignment of Assignor's Interest

Recorded: 2004-08-09 Pages: 2
Assignor
WILKINS, WENDY LEE
Executed: 2003-11-25
Assignee
UNION SEMICONDUCTOR TECHNOLOGY CORPORATION
15301 HWY 55 W, PLYMOUTH, MINNESOTA, 55497
Covered Property (1)
Die-First Multi-Chip Modules and Methods of Manufacture
Patent: 7,431,705 →
Application: 10/724,981 →
Publication: US 2005/0115065
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Attorney's Lien Aug 9, 2005
From: UNION SEMICONDUCTOR TECHNOLOGY CORPORATION
To: RIDER BENNETT, LLP
Reel/Frame 017186/0335 →
Attorney's Lien Dec 27, 2005
From: UNION SEMICONDUCTOR TECHNOLOGY CORPORATION
To: RIDER BENNETT, LLP
Reel/Frame 017136/0929 →