Security Agreement

Recorded: 2004-08-10 Received: 2004-08-13 Pages: 40

Assignor

ELECTROCHEMICALS, INC.

Executed: 2004-07-30

Assignee

ELEVEN MADISON AVENUE, NEW YORK, NY, 10010, UNITED STATES

Covered Properties (7)

Composition and Method for Preparing Chemically-Resistant Roughened Copper Surfaces for Bonding to Substrates

Application: 10/143,389 →

Apparatus and method for coating through holes of printed wiring boards with fluid

Application: 10/095,643 →

Methods of Avoiding Blowhole Formation by Conditioning Through Holes and Glass

Application: 10/087,051 →

Benzimidazole Derivatives, Processes for Preparing Them and Their Use as Pharmaceutical Compositions

Application: 10/072,334 →

Method for Roughening Copper Surfaces for Bonding to Substrates

Application: 10/028,955 →

Printed Wiring Boards and Methods for Making Them

Application: 09/954,486 →

Method to Improve the Stability of Dispersions of Carbon

Application: 09/915,444 →