IP Library › Assignment 015669/0059
Patent Assignment
Reel/Frame 015669/0059

Assignment of Assignor's Interest

Recorded: 2004-08-06 Pages: 2
Assignors
ITAKURA, MASAMI
Executed: 2004-07-28
GOI, TOMOYUKI
Executed: 2004-07-28
ADACHI, TAKUYA
Executed: 2004-07-28
Assignee
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU, TOKYO 103-8272, JAPAN
Covered Property (1)
High Frequency Switch Module and Multi-Layer Substrate for High Frequency Switch Module
Patent: 7,206,551 →
Application: 10/912,244 →
Publication: US 2005/0032484
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 7, 2017
From: TDK CORPORATION
To: SNAPTRACK, INC.
Reel/Frame 041650/0932 →