IP Library Assignment 015696/0397
Patent Assignment
Reel/Frame 015696/0397

Assignment of Assignor's Interest

Recorded: 2003-12-16 Pages: 4
Assignors
FUKUI, HIROSHI
Executed: 2003-10-21
SUTOH, MANABU
Executed: 2003-10-21
ENAMI, HIROJI
Executed: 2003-10-21
ONISHI, MASAYUKI
Executed: 2003-10-21
OKAWA, TADASHI
Executed: 2003-10-21
ONODERA, SATOSHI
Executed: 2003-10-21
Assignee
DOW CORNING TORAY SILICONE CO., LTD.
1-1-3, MARUNOUCHI, 4TH FLOOR, AIG BUILDING, CHIYODA-KU, TOKYO, 100-0005, JAPAN
Covered Property (1)
Heat-Conductive Silicone Composition
Patent: 7,329,706 →
Application: 10/476,998 →
Publication: US 2004/0254275
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 17, 2019
From: DOW CORNING TORAY CO., LTD.
To: DOW TORAY CO., LTD.
Reel/Frame 051322/0925 →