Patent Assignment
Reel/Frame 015721/0190
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2005-03-02
Received: 2005-03-02
Pages: 6
Assignors
JIN, YONGGANG
Executed: 2005-01-10
AUNG, KYAW OO
Executed: 2005-01-13
CHUA, PUAY GEK
Executed: 2005-01-13
GAN, KAH WEE
Executed: 2005-01-13
HUR, HYEONG RYEOL
Executed: 2005-01-13
LIM, SEE CHIAN
Executed: 2005-01-13
SONG, JAE-YONG
Executed: 2005-01-13
YUEN, YEW KAY
Executed: 2005-01-13
Assignee
STATS CHIPPAC LTD.
5 YISHUN ST. 23, SINGAPORE 768442, SGX, SINGAPORE
Covered Application
(1)
Under bump metallurgy in integrated circuits
App. No. 11/035,637
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