IP Library Assignment 015723/0204
Patent Assignment
Reel/Frame 015723/0204

Assignment of Assignor's Interest

Recorded: 2005-02-16 Pages: 3
Assignors
USNER, JUERGEN
Executed: 2004-06-01
WELLING, ANDO
Executed: 2004-05-27
Assignee
GIESECKE & DEVRIENT GMBH
PRINZREGENTENSTRASSE 159, 81677, MUENCHEN, GERMANY
Covered Property (1)
Method and Device for Through-Hole Plating of Substrates and Printed Circuit Boards
Patent: 7,207,107 →
Application: 10/495,564 →
Publication: US 2005/0125997
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 30, 2017
From: GIESECKE & DEVRIENT GMBH
To: GIESECKE+DEVRIENT MOBILE SECURITY GMBH
Reel/Frame 044559/0969 →