Patent Assignment
Reel/Frame 015736/0233
Assignment of Assignor's Interest
Recorded: 2004-08-30
Pages: 4
Assignor
MITSUBISHI MATERIALS CORPORATION
Executed: 2004-08-17
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OHTA-KU, TOKYO, 144-8510, JAPAN
Covered Property
(1)
Chemical Mechanical Polishing Head Assembly Having Floating Wafer Carrier and Retaining Ring