Patent Assignment
Reel/Frame 015736/0884
Assignment of Assignor's Interest
Recorded: 2004-08-23
Pages: 4
Assignors
SONG, JUNE-O
Executed: 2004-08-23
LEEM, DONG-SEOK
Executed: 2004-08-23
SEONG, TAE-YEON
Executed: 2004-08-23
Assignees
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
1 ORYONG-DONG, BUK-GU, GWANGJU-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor structure having a Cu-Based conductive layer in contact with N and Ga P-Type semiconductor layers
Application:
10/923,036 →
Publication:
US 2005/0040755
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.